2024 Korea Fintech Week to Kick Off on August 27Jul 25, 2024

The Financial Services Commission announced that this year’s global fintech expo, 2024 Korea Fintech Week, is scheduled to kick off on August 27 with major fintech businesses, financial companies, related organizations, academic institutions, and foreign governments and organizations participating at Dongdaemun Design Plaza (DDP) in Seoul.

 

This year’s global fintech expo, the largest ever in scale, will be held for three days between August 27 and 29 under the theme of “Beyond Boundaries: Fintech and AI Redefining Finance,” providing visitors and participants with opportunities to share global trends on artificial intelligence (AI) and fintech innovation and gain insights on financial industry’s future ecosystem.

 

After an opening ceremony, there will be a policy information session provided by the FSC on Korea’s fintech policy direction for this year and an on-site Q&A session with officials.

 

Visitors will have chances to participate in eleven different seminars throughout three days, dealing with topics, such as AI and fintech, fintech investment strategy, ESG, and so on, with specific focus on AI technologies and their application.

 

In addition, there will be ample opportunities to attract investments through investor relations (IR) and reverse IR events, which will help to promote investments for fintech firms to scale up or expand their businesses overseas.

 

There will be a total of 85 exhibition booths organized into four different exhibition halls—fintech hall, financial hall, cooperating organization hall, and global hall—showcasing latest fintech services embracing AI technologies.

 

During the three-day period, various consulting and networking programs will also be made available for fintech startups, entrepreneurs, and young adults seeking career opportunities in fintech.

 

Visitors can attend and tour at free of charge. For more information please visit official expo website (https://2024.fintechweek.or.kr/).


* Please refer to the attached PDF for details.